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Месяц | Минимальная цена | Макс. стоимость |
---|---|---|
Sep-17-2025 | 0.98 $* | 0.79 $* |
Aug-17-2025 | 0.46 $* | 0.5 $* |
Jul-17-2025 | 0.83 $* | 0.60 $* |
Jun-17-2025 | 0.74 $* | 0.22 $* |
May-17-2025 | 0.76 $* | 0.11 $* |
Apr-17-2025 | 0.36 $* | 0.85 $* |
Mar-17-2025 | 0.14 $* | 0.47 $* |
Feb-17-2025 | 0.45 $* | 0.68 $* |
Jan-17-2025 | 0.22 $* | 0.79 $* |
Item | specification |
Printed circuit boards | 1-30 layers |
Fast PCB | 2-3 days quick pcb production |
Featured crafts | HASL, carbon oil, hard gold plated, BGA, COB, HDI, impedance, blind and buried vias, half holes, immersion tin plating, etc |
Featured base material | Min. board thickness 0.15mm, 0.2mm super thin FR4 PCB |
Other service | PCB design, PCB +BOM clone, PCB assembly(SMT, DIP...) |
NO | Item | Process capability |
1 | product type | FR-4, High Tg, Aluminium, Copper PCB, Ceramic PCB, Polyimide PCB, Rigid-flex PCB |
2 | Max layer count | 20 layers |
3 | Min base copper thickness | 1/3 OZ (12um) |
4 | Max finished copper thickness | 10 OZ (350um) |
5 | Min trace width/spacing(Inner layer) | 2/2mil (0.05mm) |
6 | Min trace width/spacing(Outer layer) | 2/2mil (0.05mm) |
7 | Min spacing between hole to inner layer conductor | 6mil (0.15mm) |
8 | Min spacing between hole to outer layer conductor | 6mil (0.15mm) |
9 | Min annular ring for via | 4mil (0.1mm) |
10 | Min annular ring for component hole | 4mil (0.1mm) |
11 | Min BGA diameter | 4mil (0.1mm) |
12 | Min BGA pitch | 4mil (0.1mm) |
13 | Min hole size | 0.15mm(CNC); 0.1mm(Laser) |
14 | Max aspect ratios | 8.01 |
15 | Min soldermask bridge width | 4mil (0.1mm) |
16 | Soldermask/circuit processing method | Film |
17 | Min thickness for insulating layer | 1mil (0.025mm) |
18 | HDI & special type PCB | HDI(1-3 steps), R-FPC(2-16 layers), High frequency mix-pressing(2-14 layers), Buried capacitance & resistance, 0.14mm to 0.2mm extra thinner pcb,high heat conducting thermoelectric separation copper based pcb, etc |
19 | Surface treatment type | ENIG, HAL, HAL lead free, OSP, Immersion Sn, mmersion silver, Plating hard gold,Plating silver, carbon oil, ENIG immersion tin plating |
20 | Max PCB size | Multi-layer: 600*550mm 1-2 layer: 500*1200MM |
Данные ресурс не является интернет-магазином, а лишь содержит ссылки на международную торговую площадку Alibaba.com