Ручная машина для склеивания золотых проволочных шаров светодиодной
- Категория: Electronics Production Machinery >>>
- Поставщик: Guangzhou,Minder-Hightech,Co.,Ltd.
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Описание и отзывы
Трекер стоимости
| Месяц | Минимальная цена | Макс. стоимость |
|---|---|---|
| Sep-18-2025 | 0.56 $* | 0.77 $* |
| Aug-18-2025 | 0.79 $* | 0.72 $* |
| Jul-18-2025 | 0.24 $* | 0.15 $* |
| Jun-18-2025 | 0.99 $* | 0.77 $* |
| May-18-2025 | 0.57 $* | 0.19 $* |
| Apr-18-2025 | 0.75 $* | 0.18 $* |
| Mar-18-2025 | 0.55 $* | 0.0 $* |
| Feb-18-2025 | 0.1 $* | 0.29 $* |
| Jan-18-2025 | 0.29 $* | 0.64 $* |
Характеристики
Product introduction
Here we provide 3 types of most competitive manual wire bonder, thin aluminum wire wedge bonder(25-75um aluminum wire);heavy aluminum wire wedge bonder(75-500um aluminum wire);gold wire ball bonder(17-50um gold wire). they are very popular for samll quantity production, school, institution, research department.
1.Thin wire bonder MDB-2575:
Application:
Digital tube, lattice, integrated circuit soft package, integrated circuit, transistor, semiconductor devices ect.
Digital tube, lattice, integrated circuit soft package, integrated circuit, transistor, semiconductor devices ect.
Electric requirement | 220VAC±10%,50HZ,be sure connected to ground |
wire diameter | 25~75μm |
ultrasonic power | 0-3W, two channel. can be set separately of the two point |
bond time | 5-200ms,two channel |
bond force | 10-60g,two channel |
span between first bond to second bond by automatic mode | 0-10mm(motorized) |
bond radian | 0-6mm(motorized) |
jig moving area | Φ16mm |
mouse hand | 20*20mm |
digital camera | optional |
dimension | 600*560*390mm |
weight | 36kg |
2:Heavy wire bonder MDB-7550:
Application:
High power dynatron/FET/SCR, Power module, IGBT, High power Fast recovery diode, Schottky transistor, Lead attachment, wire bonding, TO-3,TO-3P,TO-3PF,TO-3PN,TO-3PL,TO-220F,TO-126, TO-12F,TO-66,TO-251,TO-202 etc.
High power dynatron/FET/SCR, Power module, IGBT, High power Fast recovery diode, Schottky transistor, Lead attachment, wire bonding, TO-3,TO-3P,TO-3PF,TO-3PN,TO-3PL,TO-220F,TO-126, TO-12F,TO-66,TO-251,TO-202 etc.
electric requiement | 220VAC±10%,50HZ,be sure connected to ground |
aluminium wire diameter | 75~500μm (3~20mil) |
ultrasonic power | 0-30W, two channel.can be set separately of the two point |
bond time | 10-500ms,two channel |
bond force | 30-1200g,two channel |
motorized Y | 0-18mm |
microscope rate | 7.5 and 15 |
working area | Φ25mm |
light | adjustable brightness |
size | 620×610×560mm |
weight | ~40kg |
3:gold wire ball bonder MDBB-1750:
Application:
LED, chips, diode, laser tube, the inner lead, semiconductor devices etc.
LED, chips, diode, laser tube, the inner lead, semiconductor devices etc.
electric requiement | 220VAC±10%,50HZ,be sure connected to ground |
wire diameter | 17~50μm |
ultrasonic power | 0-3W, two channel. can be set separately of the two point |
bond time | 0-200ms,two channel |
bond force | 35-180g,two channel |
digital camera systerm | optional |
min bonding time | 0.4s/wire |
span between first bond to second bond by automatic mode | more than 4mm. |
length of terminal wire | 0-2mm |
ball dimension | 2-4 times bigger setable |
bond temperature | house temperature ~ 400°C |
jig moving area | Φ25mm |
microscope | 15X,30X |
dimension | 700*460*550mm |
weight | 28kg |
application
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If you if you want to konw more,please contact our sales engineer:
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