Au80Sn20 паяльная Преформа Au50Cu50 Au80Cu20 Au100 Au88Ge12

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Au80Sn20 solder preforms

 

Au80Sn20 Preforms

Au80Sn20 eutectic solder has strong inoxidizability, good creep resistance and well wettability. Joints formed by Au80Sn20 with high strengthand and thermal conductivity can be obtained. Au80Sn20 preforms are mainly used in optoelectronics package, high reliability package(e.g. InP laser diodes package), hermetic package of high power device, die bonding, etc. 

Au88Ge12 Preforms

Au88Ge12 eutectic solder has many merits such as low vapour pressure, low contact resistance, strong adhesion to the substrate, well conductivity, high thermal conductivity. Au88Ge12 along with metal such as Au and Ni constitute M/S system acting as ohmic contact in GaAs MEMSFET. Furthermore, Au88Ge12 is widely used as lower melting temperature solder of transistors, integrated circuit, etc.

Au80Cu20 & Au50Cu50 Preforms

Au-Cu brazing filler metal has suitable melting temperature, superior flowability and ability to fill tiny gap. Its wettability on Cu, Ni, Fe, Co, W, Mo, Ta, Nb and their alloys is fine. In addition, no fierce chemical reaction occurs between Au-Cu alloy and base metal, which avoids lowering strength and dimensional accuracy of workpiece. Au-Cu brazing filler metal is widely used in brazing vacuum components such as high power magnetrons, waveguides and vacuum instrument components.

We offer preform with accurate composition and meiling temperature. Shapes such as disk,ring, rectangle, frame are available to meet different demands according to your applications.  

 

Applications

Au80Sn20 solder preforms Metallized fiber die bonding

 

 

 

Alloy Parameter

Au80Sn20	Physical Properties
Density	14.7 g⋅cm-3
Coefficient of thermal expansion*	16 ⋅ 10-6 /°C
Thermal conductivity	57 W⋅m-1⋅K-1
Tensile strength	275 MPa
Young’s modulus	68 GPa
Shear modulus	25 GPa
Poisson’s ration	0.405
Electrical resistivity	16.4 ⋅10-8 Ω⋅m
Elongation	2%