BesI.MX6 A9 двухъядерная Встроенная платформа Linux для промышленной
- Категория: Материнские платы >>>
- Поставщик: Zhejiang,Qiyang,Intelligent,Technology,Co.,Ltd.
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Описание и отзывы
Трекер стоимости
| Месяц | Минимальная цена | Макс. стоимость |
|---|---|---|
| Sep-18-2025 | 0.10 $* | 0.97 $* |
| Aug-18-2025 | 0.6 $* | 0.51 $* |
| Jul-18-2025 | 0.94 $* | 0.45 $* |
| Jun-18-2025 | 0.37 $* | 0.12 $* |
| May-18-2025 | 0.74 $* | 0.10 $* |
| Apr-18-2025 | 0.21 $* | 0.68 $* |
| Mar-18-2025 | 0.1 $* | 0.94 $* |
| Feb-18-2025 | 0.82 $* | 0.94 $* |
| Jan-18-2025 | 0.11 $* | 0.42 $* |
Характеристики
Best N XP I.MX6 ARM Cortex-A9 dual core embedded Linux board for industrial automation![IMX6_01.jpg]()
Product information
SOM Resource
CPU | Freescale i.MX6 processor, ARM® Cortex™-A9 kernel Dual Core (Solo Core, Quad Core optional) |
Frequency | 1.0Ghz |
GPU | OpenGL® ES 2.0 and OpenVG™ 1.1 Hardware Accelerators & Multi-Format HD1080p Video Decoder and HD720p Video Encoder Engine |
RAM | 1GB (2GB optional) |
Flash | |
Telecommunication | UART, USB, CAN, MINI-PCIE, Ethernet, GPIO, I2C, EIM, MIPI, etc. |
Display | LVDS, TTL, HDMI, VGA |
Audio | audio output, MIC audio input |
Storage | SD, SATA-II |
B to B Connector | FCI 3*100 pin 0.8mm spacing B to B (the connectors are 350℃ high temperature-tested and seismic-tested) |
OS Support | Linux 3.0.101/Android 4.4 |
Mechanical and Environment
PCB Specification & Size | Using 8-layer PCB high precision process, with the best electrical properties and anti-jamming performance |
86 x 60x 1.5mm | |
Working Parameters | Working temperature: -20°C~ 70°C. (Batch order could be customized to -40°C~ 85°C) |
Humidity Range: 5%~ 95%, Non-Condensing | |
Low Power Consumption | 5V DC power supply, low power consumption: <1W; Power Management Chipset, support 1.8V/3.3V/5.0V voltage input |
Form Factor | System on Module+ Carrier Board |
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