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PCB Manufacture Capacity

Item

Specification

Material

FR-4, FR1,FR2; CEM-1, CEM-3,Rogers, Teflon,Arlon,Aluminum Base, Copper Base,Ceramic, Crockery, etc.

Remarks

High Tg CCL is Available(Tg>=170℃)

Finish Board Thickness

0.2 mm-6.00mm(8mil-126mil)

Surface Finish

Gold finger(>=0.13um), Immersion Gold(0.025-0075um), Plating Gold(0.025-3.0um), HASL(5-20um), OSP(0.2-0.5um)

Shape

Routing,Punch,V-cut,Chamfer

Surface Treatment

Solder Mask(black, green, white, red, blue, thickness>=12um, Block, BGA)

Silkscreen(black, yellow, white)

Peel able-mask(red, blue, thickness>=300um)

Minimum Core

0.075mm(3mil)

Copper Thickness

1/2 oz min; 12oz max

Min Trace Width & Line Spacing

0.075mm/0.075mm(3mil/3mil)

Min Hole Diameter for CNC Drilling

0.1mm(4mil)

Min Hole Diameter for Punching

0.6mm(35mil)

Biggest panel size

610mm * 508mm

Hole Position

+/-0.075mm(3mil) CNC Drilling

Conductor Width(W)

+/-0.05mm(2mil) or +/-20% of original

Hole Diameter(H)

PTHL:+/-0.075mm(3mil)

Non PTHL:+/-0.05mm(2mil)

Outline Tolerance

+/-0.1mm(4mil) CNC Routing

Warp & Twist

0.70%

Insulation Resistance

10Kohm-20Mohm

Conductivity

<50ohm

Test Voltage

10-300V

Panel Size

110 x 100mm(min)

660 x 600mm(max)

Layer-layer misregistration

4 layers:0.15mm(6mil)max

6 layers:0.25mm(10mil)max

Min spacing between hole edge to circuitry pattern of an inner layer

0.25mm(10mil)

Min spacing between board outline to circuitry pattern of an inner layer

0.25mm(10mil)

Board thickness tolerance

4 layers:+/-0.13mm(5mil)

FPC Tech Specification

Items

Capabilities

Layers

FPC:1 to 6 Layers, Rigid Flex: 2 to 10 Layers

Regular Base Materials

Kapton,Polyimide(PI), Polyester(PET), FR4

Base Copper Thickness

1/3 oz to 8oz

Regular Base Material Thickness

12.5um to 50um(FPC)

0.1mm to 3.2mm(Rigid)

Regular Coverlay Thickness

27um to 50um

Regular Adhesive Thickness

12um to 25um

Blind or Buried Vias

Yes

Impedance Control

Yes

Min.Line Width/Spacing

0.04mm/0.04mm

Surface Finishing

Electroplate Ni/Au(Flash gold/Soft gold/Hard gold), ENIG, HASL, Immersion Tin,OSP

Outline Fabrication

Die cut, laser cut, CNC routing, V-scoring

Hole to edge(Hard tool/Die Cut)

±0.1/±0.2mm

Edge to edge(Hard tool/Die Cut)

±0.05/±0.2mm

Circuit to edge(Hard tool/Die Cut)

±0.07/±0.2mm

SMT Capacity

SMT Item

Capacity

PCB Max. size

510mm*1200mm(SMT)

Chip component

 0201, 0402, 0603, 0805, 1206 package

Min.pin space of IC

0.1mm

Min. space of BGA

0.1mm

Max.precision of IC assembly

±0.01mm

Assembly capacity

≥8 million piots/day

DIP capacity

6 DIP production lines

Assembly testing

Bridge test,AOI test, X-Ray test, ICT(In Circuit Test),FCT(Functional Circuit Test)

FCT(Functional Circuit Test)

Current test, voltage test, high temperature and low temperature test,Drop Impact Test,aging test,water proof test,leakage-proof test and etc.Different test can be done according to your requirement.