(Чипы ИС) Электронные компоненты China

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Трекер стоимости

Характеристики

(IC Chips) Electronic Components China ESP8266MOD

 

  

 

Broadest BOM Coverage of Electronic Components

 

 

 

IC	MCU	IGBT	Module
Memory	Relay	Crystal	Connectors
Rectifiers	Inductors	Resistors	Capacitors
Switches	Transistors	Led	Buzzer
Diode	Terminal	Audion	LCD

 

 

 

 

 

Advantage Brand & Service 

 

-Over than 17 years experience on Electronic Components

 

-Within 12 Hours quickly reply , mass stock & Fast delivery

 

-100% Quality guarantee on all products

 

-Electronis Components Distributor Since 2000,knowledgeable & experienced sales 

 

-Broadest BOM converage of Electronic Components

 

-More than 20000 ICs in stock for sale

 

-500000 parts of ICs,Diodes,Transistors,Capacitors,Connectors & Resistors available

 

 

 

 

 

Quality Control 

 

1.Visual inspection

 

Using 3D microscope to test components from 360 degrees. Emphasis on checking outer packing condition, checking complete parts number, date code and lot code on the label; Chips marking and body condition; terminal layout, coplanarity and electroplating status, etc.; check if dimensions of the chip is in accordance with the specification of the datasheet, etc.

 

 

 

2.Acetone test

 

Use American army regulation chemical agent wipe the test object, to identify if this chips has been remarked or not.

 

 

 

3.X-ray inspection

 

Use X-Rays to analysis the internal structure of chips. With X-ray detection, we can find out if the internal structure of test objects are consistent or they are mixed parts; Mixed parts means there are different size wafer, different base, different wire frame, different lineup from the same batch products, etc.; In addition, it also can intuitively see the internal wire of chips open / short circuit, these defective will directly cause the product function failure.

 

 

 

4.Pin Assignment test

 

Check the X-Ray image of test object according to the Pin definition on original datasheet, identify if the chips Pin definition is consistent.

 

 

 

5.De-capsulation test

 

Take out the die with chip anatomical methods, analysis the die logo, wire, structure, MASK etc, to identify whether the chips are from original factory.

 

 

 

6.Function test

 

Use of VLSI/SOC test system, its diversified test function can be applied to display IC, LED IC, power IC, digital consumption IC, CSTN, OLED, MCU and peripheral devices of IC etc, testing center provides the most economical production testing and comprehensive test plan, provide complete Socket to meet various needs of packaging style. And we have the special transistor test instrument, LCR instruments to test the passive components, transistor, etc.

 

 

 

Payment

 

We accept payment in advance before shipment , you can choose pay by as you like

 

 

 

 

Shipment 

 

Shipment term: Ship via UPS, FEDEX , DHL, TNT & EMS express, depends on customer's requirement.

 

1.Usually , it spends 3-5 days to your end shipping by above express ,except for force majeure .

 

2.Parts can be ship out soon as the delivery date as the agreement .

 

3 Any import fees or charges are the buyer's responsibility.

 

 

Contact Us 

 

Company :Chuangxinda Electronics-Tech,Co.Limited

 

Skype :tina_10141 

 

QQ ID: 2355813653

 

Tel: 86 755 83218995

 

Fax: 86 755 83957975

 

Contact : T

 

www.cxda.com