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Месяц | Минимальная цена | Макс. стоимость |
---|---|---|
Sep-18-2025 | 298.70 $* | 313.6 $* |
Aug-18-2025 | 295.55 $* | 310.90 $* |
Jul-18-2025 | 248.61 $* | 260.10 $* |
Jun-18-2025 | 290.76 $* | 305.85 $* |
May-18-2025 | 253.32 $* | 266.19 $* |
Apr-18-2025 | 285.32 $* | 299.67 $* |
Mar-18-2025 | 283.37 $* | 297.13 $* |
Feb-18-2025 | 280.87 $* | 294.56 $* |
Jan-18-2025 | 278.95 $* | 292.75 $* |
Grade | Zero MPD Production | Standard Production Grade(P Grade) | Dummy Grade(D Grade) | ||||
Diameter | 99.5mm-100mm | ||||||
Thickness | 4H-N | 350μm±15μm | 350μm±25μm | ||||
4H-Si | 500μm±15μm | 500μm±25μm | |||||
Wafer Orientation | Off axis:4.0°toward<1120>±0.5°for4H-N,On axis:<0001>±0.5° for 4H-Si | ||||||
Micropipe Density | 4H-N | ≤0.2cm² | ≤2cm² | ≤15cm² | |||
4H-Si | ≤1cm² | ≤5cm² | ≤15cm² | ||||
Resistivity | 4H-N | 0.015-0.024Ω.cm | 0.015-0.028Ω.cm | ||||
4H-Si | ≥1E10Ω.cm | ≥1E5Ω.cm | |||||
Primary Flat Orientation | {10-10}±5.0° | ||||||
Primary Flat Length | 32.5mm±2.0mm | ||||||
Secondary Flat Length | 18.0mm±2.0mm | ||||||
Secondary Flat Orientation | Silicon face up:90°CW. from Prime flat±5.0° | ||||||
Edge Exclusion | 3mm | ||||||
LTV/TTV/Bow/Warp | ≤2.5μm/≤5μm/≤15μm/≤30μm | ≤10μm/≤15μm/≤25μm/≤40μm | |||||
Roughness | Polish Ra≤1nm | ||||||
CMP Ra≤0.2nm | Ra≤0.5nm | ||||||
Edge Cracks By High Intensity Light | None | None | Cumulative length ≤10mm,single length≤2mm | ||||
Hex Plates By High Intensity Light | Commulative area≤0.05% | Commulative area≤0.1% | |||||
Polytype Areas By High Intensity Light | None | None | Commulative area≤3% | ||||
Visual Carbon Inclusions | Commulative area≤0.05% | Commulative area≤3% | |||||
Silicon Surface Scratches By High Intensity Light | None | None | Cumulative length ≤1×wafer diameter | ||||
Edge Chips By High Intensity Light | None permitted≥0.2mm width and depth | 5 allowed,≤1mm each | |||||
Silicon Surface Contamination By High Intensity Light | None | None | None | ||||
Threading screw dislocation(TSD) | ≤500cm² | N/A | N/A | ||||
Packaging | Multi-wafer Cassette Or Single Wafer Container |
8"N type silicon carbide double side polished wafer | ||||||||||
REV.01(2022.08) | ||||||||||
NO. | Item | Unit | Production | Research | Dummy | |||||
1 Crystal data | ||||||||||
1.1 | polytype | ---- | 4H | 4H | 4H | |||||
1.2 | surface orientation | ° | <11-20>4±0.5 | <11-20>4=0.5 | <11-20>4±0.5 | |||||
2 Optical data | ||||||||||
2.1 | dopant | ---- | n-type Nitrogen | n-ype Nitrogen | n-type Nitrogen | |||||
2.2 | resistivity | ohm:cm | 0.015-0.025 | 0.01~0.03 | NA | |||||
3 Mechanical date | ||||||||||
3.1 | diameter | mm | 200±0.2 | 200±0.2 | 200±0.2 | |||||
3.2 | thickness | μm | 500±25 | 500±25 | 500±25 | |||||
3.3 | Nolch Notch orientation | ° | [1-100]+5 | 1-100]+5 | [1-100]+5 | |||||
3.4 | Notch Notch Depth | mm | 1~1.5 | 1~1.5 | 1~1.5 | |||||
3.5 | LTV | μm | ≤5(10mm*10mm) | ≤5(10mm*10mm) | ≤10(10mm*10mm | |||||
3.6 | TTV | μm | ≤10 | ≤10 | ≤15 | |||||
3.7 | Bow | μm | 25-25 | 45-45 | 65-65 | |||||
3.8 | Warp | μm | ≤30 | ≤50 | ≤70 | |||||
3.9 | AFM | nm | Ra≤0.2 | Ra≤0.2 | Ra≤0.2 | |||||
4 Structure | ||||||||||
4.1 | micropipe density | ca/cm² | ≤2 | ≤10 | ≤50 | |||||
4.2 | metal content | atoms/em | ≤1E11 | ≤1E11 | NA | |||||
4.3 | TSD | ca/cm2 | ≤500 | ≤1000 | NA | |||||
4.4 | BPD | ea/cm2 | ≤2000 | ≤5000 | NA | |||||
4.5 | TED | ca/cm2 | ≤7000 | ≤10000 | NA | |||||
5 Front details | ||||||||||
5.1 | front | ---- | Si | Si | Si | |||||
5.2 | surface finish | ---- | Si CMP Si-face CMP | Si CMP Si-face CMP | Si CMP Si-face CMP | |||||
5.3 | particle | eu/wafer | 100(size20.3μm) | NA | NA | |||||
5.4 | scratch | ca/wafer | s5,Total Lengths200mm | NA | NA | |||||
5.5 | Edge chips/indentsleracks/stainsicontamination | ---- | None | None | NA | |||||
5.6 | Polytype areas | ---- | None | Arca≤10% | Area≤30% | |||||
5.7 | front marking | ---- | None | None | None | |||||
6 Back details | ||||||||||
6.1 | back finish | ---- | C MP C-face MP | C MP C-face MP | C MP C-face MP | |||||
6.2 | scratch | /mm | NA | NA | NA | |||||
6.3 | Back defects edge chips/indents | ---- | None | None | NA | |||||
6.4 | Back roughness | nm | Ras5 | Ras5 | Ras5 | |||||
6.5 | back marking | ---- | Notch | Notch | Notch | |||||
7 edge | ||||||||||
71 | edge | ---- | Chamfer | Chamfer | Chamfer | |||||
8 package | ||||||||||
8.1 | packagin | ---- | Epi-ready with vacuum packaging | Epi-ready with vacuum packaging | Epi-ready with vacuum packaging | |||||
8.2 | packaging | ---- | Multi-wafer cassette packaging | Multi-wafer cassette pickaging | Multi-wafer cassette packaging | |||||
Note:NA means no requirements |
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