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Месяц | Минимальная цена | Макс. стоимость |
---|---|---|
Sep-16-2025 | 0.1 $* | 0.93 $* |
Aug-16-2025 | 0.9 $* | 0.50 $* |
Jul-16-2025 | 0.73 $* | 0.43 $* |
Jun-16-2025 | 0.26 $* | 0.60 $* |
May-16-2025 | 0.87 $* | 0.3 $* |
Apr-16-2025 | 0.23 $* | 0.59 $* |
Mar-16-2025 | 0.12 $* | 0.98 $* |
Feb-16-2025 | 0.32 $* | 0.92 $* |
Jan-16-2025 | 0.48 $* | 0.36 $* |
Shenzhen factory process capability | ||
Sheet type | Ordinary FR4, high TgFR4, high CTI FR4, halogen-free FR4, copper-based, aluminum-based, PTFE, PI | |
Maximum delivery size | 1200×572 mm | |
Min. finished plate thickness | L≤2L:0.1mm;4L:0.3mm | |
Maximum finished plate thickness | 10.0 mm | |
Blind buried holes (not crossed) | 0.1 mm | |
Maximum hole diameter aspect ratio | 15:1 | |
Minimum mechanical drilling hole diameter | 0.15 mm | |
Through-hole tolerance/crimp hole tolerance/non-crimp hole tolerance | +/-0.0762mm/+/-0.05mm/+/-0.05mm | |
Maximum number of layers | 32 | |
Maximum copper thickness of inner and outer finish | 12 OZ | |
Minimum Drilling Tolerance | +/-2mil | |
Minimum interlayer tolerance | +/-3mil | |
Min. line width/line spacing | 2.5/2.5mil | |
Minimum BGA diameter | 8mil | |
Surface treatment process | Leaded/lead-free tin spraying, gold sinking | |
Electro-gold, gold finger, sunken silver/tin, OSP, sunken nickel palladium gold, carbon oil, blue glue, paste gold glue, etc. |
Shenzhen factory process capability | ||
Sheet type | Ordinary FR4, high TgFR4, high CTI FR4, halogen-free FR4, copper-based, aluminum-based, PTFE | |
Maximum size is good | 540×620 mm | |
Min. finished plate thickness | 0.20 mm | |
Maximum finished plate thickness | 8.0 mm | |
Blind buried holes (not crossed) | 0.2 mm | |
Maximum hole diameter aspect ratio | 12:1 | |
Minimum mechanical drilling hole diameter | 0.20 mm | |
Through-hole tolerance/crimp hole tolerance/non-crimp hole tolerance | +/-0.0762mm & +/-0.05mm & +/-0.05mm | |
Maximum number of layers | 16 | |
Maximum copper thickness of inner and outer finish | 6 OZ | |
Minimum Drilling Tolerance | +/-2mil | |
Minimum interlayer tolerance | +/-3mil | |
Min. line width/line spacing | 3/3mil | |
Minimum BGA diameter | 10mil | |
Surface treatment process | Leaded/lead-free tin spraying, gold sinking | |
Electro-gold, gold finger, sunken silver/tin, OSP, sunken nickel palladium gold, carbon oil, blue glue, paste gold glue, etc. |
Данные ресурс не является интернет-магазином, а лишь содержит ссылки на международную торговую площадку Alibaba.com