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Месяц | Минимальная цена | Макс. стоимость |
---|---|---|
Sep-18-2025 | 0.89 $* | 0.70 $* |
Aug-18-2025 | 0.79 $* | 0.5 $* |
Jul-18-2025 | 0.21 $* | 0.5 $* |
Jun-18-2025 | 0.59 $* | 0.14 $* |
May-18-2025 | 0.39 $* | 0.24 $* |
Apr-18-2025 | 0.5 $* | 0.63 $* |
Mar-18-2025 | 0.21 $* | 0.25 $* |
Feb-18-2025 | 0.32 $* | 0.59 $* |
Jan-18-2025 | 0.56 $* | 0.19 $* |
Item | Capabilities |
Layer Count | 1 - 30 Layers |
Max Board Dimension | 1L:500*2000mm; 2L:250*1380mm |
Min Board Thickness | 0.05mm |
Max Board Thickness | 3.0mm |
Conductor Thickness | 1/3 OZ(12 um) - 4OZ(140um) |
Min Line Width/Line Space | 2/2mil (0.05/0.05mm) |
Min Hole Diameter | 4mil (0.10mm) |
Min Hole Spacing | NPTH:16mil (0.4mm); PTH:20mil(0.5mm) |
Min PAD Ring(Single) | 3mil (0.075mm) |
PTH Wall Thickness | 0.59mil (15um) |
Min Solder PAD Dia | 10mil (0.25mm) |
Min Soldermask Bridge | 12mil (0.30mm) |
Min BAG PAD Margin | 12mil (0.30mm) |
PTH/NPTH Dia Tolerance | PTH: ±3mil (0.075mm); NPTH: ±2mil (0.05mm) |
Hole Position Deviation | ±4mil (0.10mm) |
Outline Tolerance | Laser: +0.15mm / -0.05mm; Die Punch: +0.10 / -0.20 mm |
Max Aspect Ratio | 8:01 |
Surface Treatment | ENIG, Flash Gold, Hard Gold Finger, Gold Plating(50mil), Gold Finger, Selected Gold Plating, ENEPIG, ENIPIG |
Impedance Controlled | Value>50ohm: ±10%; Value≤50ohm: ±5 ohm |
Данные ресурс не является интернет-магазином, а лишь содержит ссылки на международную торговую площадку Alibaba.com