K-539/K-569A
Special solder paste for LED patch, suitable for LED lights/light bars/light strips, K-569A welding ability is better than K-539.
Feature: LED patch is not easy to shift, not easy to fry tin, cost-effective, economical and practical
T3 25~45um
K-439 has low temperature of lead and its melting point is 158 degrees.
Applicable: Paper boards that can't withstand high temperature or those with special welding requirements for temperature resistance!
Suitable for SMT production process products with special welding
Features: The melting point of 158 degrees is low enough, and the cost performance is high!
Weight: 50g/100g/200g/500g
Sn43Bi14Pb43 25-45um(No. 3 powder)
K-735(SnPb37 No.3 powder):Suitable for simple IC PCB with 0.5mm pitch
K-735B(SnPb37 No.4 powder):Suitable for 0.4mm pitch dense-footed IC PCB
K-735C(SnPb37 No.5 powder):Suitable for 0.3mm pitch multi-pin IC PCB
Feature:Strong upper tin, less tin connection, uniform solder joints, full and bright
K-615B:Suitable for hard-to-tin QFN PCB mounting
Features: solder joints are full and bright, with less tin
Lead-free high temperature, melting point 217 degrees, lead-free Environmental Protection/round welding spot/easy printing/no virtual welding
Granules: 20-38um (No.4 powder)
K-635B
Feature:The tinning ability is stronger than 6337, the solder joints are full and bright, and the tin is less
K-635B has a moderate temperature of lead and a melting point of 183 degrees.
Applicable: mobile phone repair, Suitable for QFN/BGA package PCB
Features: Silver-containing tin paste, good conductivity, strong welding, less tin, even and full.
Weight: 50g/100g/200g/500g
Sn62.8Pb36.8Ag0.4
KZ-1513 lead-free low temperature, melting point 138 degrees.
Applicable: paper that can't withstand high temperature or has special welding requirements for temperature resistance!It can meet SMT production of process products with special welding requirements for temperature resistance, LED patch
Features: Environment-friendly and lead-free, 138 C melting point is low enough.
Weight: 50g/100g/200g/500g
Sn42Bi58 Granules: 25-45um (No.3 powder)
KZ-1551 lead-free high temperature, melting point 217 degrees.
Applicable to high temperature resistant double-sided glass fiber PCB board.
Features: environmental protection, lead-free, high melting point of 217 degrees.
Weight: 50g/100g/200g/500g
Sn99Ag0.3Cu0.7 Granules: 25-45um (No.3 powder)
KZ-1358 183 degrees
Lead-free, less tin.
Full solder joints, easy printing and good expansibility.
Composition: Sn64Bi35Ag1
Granules: 25-45um (No.3 powder) Weight: 200g/500g
KZ-1354
Environment-friendly lead-free soldering 305 high-temperature solder paste
One kilogram of solder paste contains 30 grams of silver.
One bottle of solder paste is 500g, that is, one bottle of solder paste contains 15g of silver.
Wide application, high/middle/low end welding
(Sn96.5Ag3Cu0.5) Melting point: 217 degrees
Enhanced electrical conductivity, strong welding ability, welding light
Granules: 20-38um (No.4 powder)
Need to pay attention when using
To work in a ventilated environment
Avoid frequent skin contact,If it gets on the skin, wipe it with alcohol and rinse with water
Do not touch sensitive parts
How to store the solder paste?
It can be stored at room temperature, and can be stored for a longer time under refrigeration conditions of 0-10 degrees
Celsius,If refrigerated, take out an hour before use.