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Месяц | Минимальная цена | Макс. стоимость |
---|---|---|
Sep-15-2025 | 0.99 $* | 0.70 $* |
Aug-15-2025 | 0.52 $* | 0.57 $* |
Jul-15-2025 | 0.45 $* | 0.91 $* |
Jun-15-2025 | 0.74 $* | 0.17 $* |
May-15-2025 | 0.53 $* | 0.56 $* |
Apr-15-2025 | 0.17 $* | 0.27 $* |
Mar-15-2025 | 0.66 $* | 0.65 $* |
Feb-15-2025 | 0.95 $* | 0.26 $* |
Jan-15-2025 | 0.85 $* | 0.57 $* |
Item | Flex PCB | ||
Material | PI, PET | ||
Layers | 1-12 | ||
Base Copper Thickness | 1/4-2OZ | ||
Board Thickness(Min.) | Single-sided | 0.05mm | |
Double-sided | 0.10mm | ||
Board Dimension(Max.) | 500mm*1000mm | ||
Width/Space(Min.) | Copper Weight: up to 0.2OZ | 0.04mm | |
Copper Weight: up to 0.5OZ | 0.06mm | ||
Copper Weight: 0.5-1OZ | 0.075mm | ||
Copper Weight: over 1OZ | 0.10mm | ||
Via Type | Through Hole, Blind, Buried | ||
Silkscreen Width/Space(Min.) | 0.10mm | ||
Solder Mask Bridge(Min.) | 0.2mm for coverlay, 0.12mm for LPI | ||
Hole(Min.) | Drill | 0.15mm | |
Punching | 0.5mm | ||
Slot(Min.) | 0.5mm(Punching), 0.8mm(Routing) | ||
Dimension Tolerance | Line Width | ±0.03mm(W≤0.3mm), ±10%(W>0.3mm) | |
Hole | ±0.05mm(NPTH) | ||
±0.075mm(PTH) | |||
Outline | ±0.10mm, Special±0.05mm with high-precise hard tool | ||
Conductor to Outline | ±0.10mm, Special±0.05mm with high-precise hard tool | ||
Surface Treatment | Ni/Au Plating | Ni: 2-8um(80-320u") Au: 0.05-2um(2-80u") | |
ENIG | Ni: 2-6um(80-240u") Au: 0.05-0.10um(2-4u") | ||
Tin Plating | 5-20um | ||
Immersion Silver | 0.2-0.4um | ||
Immersion Tin | 1um(Min.) | ||
OSP | 0.2um(Min.) | ||
Hard Gold | Hardness over 150HV | ||
Others | Gold Plating+ENIG; ENIG+OSP; ENPIG |
Данные ресурс не является интернет-магазином, а лишь содержит ссылки на международную торговую площадку Alibaba.com