Многослойная печатная плата импульсная силовая монтажная

Seq

Item

capability

1

Base Material

FR-4, High TG FR-4 , Halogen Free material ,CEM-3,CEM-1,PTFE,Rogers ,Arlon ,Taconic,Aluminum base,PI ,etc

2

Layers

1-40 ( ≥30 layers needs review )

3

Finished inner/outer copper thickness

0.5-6OZ

4

Finished board thickness

0.2-7.0mm(≤0.2mm needs review),≤0.4mm for HASL

Board thickness≤1.0mm: +/-0.1mm
1<Board thickness≤2.0mm: +/-10%
Board thickness>2.0mm: +/-8%

5

Max panel size

≤2sidesPCB: 600*1500mm
Multilayer PCB: 500*1200mm

6

Min conductor line width/spacing

Inner layers: ≥3/3mil
Outer layers: ≥3.5/3.5mil

7

Min hole size

Mechanical hole: 0.15mm
Laser hole: 0.1mm

8

Drilling precision: first drilling       First drilling: 1mil
                                                    Second drilling: 4mil

9

Warpage

Board thickness≤0.79mm: β≤1.0%
0.80≤Board thickness≤2.4mm: β≤0.7%
Board thickness≥2.5mm: β≤0.5%

10

Controlled Impedance

+/- 5 % Ω(<50Ω),+/-10%(≥50Ω),≥50Ω+/-5% (needs review)

11

Aspect Ratio

15:01

12

Min welding ring

4mil

13

Min solder mask bridge

≥0.08mm

14

Plugging vias capability

0.2-0.8mm

15

 Hole tolerance

PTH: +/-3mil
NPTH: +/-2mil

16

Outline profile

Rout/ V-cut/ Bridge/ Stamp hole

17

Solder mask color

Green,yellow,black,blue,red,white,matte green

18

Component mark color

white,yellow,black