Система Android RK3399 одноъядерная плата rockchip материнская с 2 Гб ОЗУ 8 ГБ


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Трекер стоимости

Месяц Минимальная цена Макс. стоимость
Sep-19-2025 0.96 $* 0.22 $*
Aug-19-2025 0.70 $* 0.28 $*
Jul-19-2025 0.37 $* 0.2 $*
Jun-19-2025 0.58 $* 0.65 $*
May-19-2025 0.58 $* 0.38 $*
Apr-19-2025 0.70 $* 0.53 $*
Mar-19-2025 0.85 $* 0.13 $*
Feb-19-2025 0.28 $* 0.45 $*
Jan-19-2025 0.15 $* 0.37 $*

Характеристики



Product Description


Android system RK3399 cortex-A72 single core Board rockchip motherboard with 2GB RAM 8GB eMMC





Product Paramenters















Hardware Resource

CPU
Rockchip RK3399 (28nm HKMG processing) hexa-core 64 bits processor, the CPU frequency reaches up to 1.8Ghz, it is based on the
big.LITTLE architecture, dual core with Cortex-A72(Big Core)+ Quad Core with Cortex-A53(Little Core).

GPU
ARM® Mali-T860 MP4 Quad Core GPU.
Support OpenGL ES1.1/2.0/3.0/3.1,OpenVG1.1,OpenCL,DX11
Support AFBC (Frame buffer Compression)


Video Processor
Support 4K VP9 and 4K 10bits H265/H264 video decoding , with 60fps
1080p multiformat video decoding (WMV,MPEG-1/2/4,VP8)
1080P video decoding, support H.264, VP8 format
Video anaphase processor: Anti-interlacing, denoising, edge/detail/color optimization
RAM
2GBDDR (64bit data bus LPDDR4) (4GB optional)
FLASH
8GB eMMc, eMMc5.1(8GB/16GB/32GB optional)
PMU
RK808 Power Management Unit





Communication
5-ch UART, support UART with fluid control.
2-ch USB-HOST2.0: Including 1-ch USB-HOST 3.0, 1-ch USB-Type-C.
Support Gigabit Ethernet
Support 3-ch PWM port
6-ch I2C port
4-ch ADC port
1-ch SPI port
SDIO port
1-ch PCI-e 2.0 connector
I2S to support 8-ch digital voice input
Reserve partial GPIO ports.

Display
Support MIPI display connector (4 channels)
Support EDP display connector (4 channels)
Support HDMI2.0, HD video and audio output port.
CAMERA
MIPI CSI port
Power Input
5V power input






Software Resource
OS
Support Android, Linux, Ubuntu, Debian

Electrical Specification



Materials


To provide the relative BSP, DEMO, APK
SOM Size
63mmx82mmx4mm
Board To Board
connector
SMARC interface,
1.1mm pitch, 317Pins
Bonding Pad Size
1.3mm*0.7mm
Operational Temperature
-20℃ ~ +70℃
Humidity
5%~95%, non-condensation


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