Высокосинтетическая безгалогенная паяльная паста MECHANIC MCN UV80 UV50 BGA Электрический паяльник сварочные

Product Features

1. 100% brand new and high quality.

2. High synthetic BGA Solder Paste Tin Rosin-Based Flux Paste Cream.

3. PH value neutral, insulation is strong, welding surface smooth.

4. Professional Soldering Tin Flux for PC Cards Electronic Chip-level Welding.

5. Its boiling point only slightly higher than the melting point of the solder.

6. Unique recipes, perfect performance, easy to weld, solder bright and full, no weld, false welding and so on.

7. Good soldering and welding tools.

8. IC and PCB for no corrosive

9. Super compacity: Applicable to PCB, BGA, SMD, PGA repair repair, Soldering, etc.

10. Rosin-based Solder Paste.



Product Specifications

Material: Plastic+ Rosin-based solder paste Size: 40g, 60g

Type: Rosin-based BGA solder flux cream

Model Number: UV 50/80

Viscosity: 0.2Pas

Granularity: 0.22um

Application: for Phone BGA Board Soldering Fixing

Function: PC Cards Electronic Chip-level Welding



Instructions: 1. Wipe the surface of the object before soldering

2. Apply the paste flux to the solder joint

3. Solder the tin to the solder joint with soldering iron.









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