Поделиться:
Месяц | Минимальная цена | Макс. стоимость |
---|---|---|
Sep-20-2025 | 0.43 $* | 0.57 $* |
Aug-20-2025 | 0.44 $* | 0.83 $* |
Jul-20-2025 | 0.44 $* | 0.71 $* |
Jun-20-2025 | 0.43 $* | 0.55 $* |
May-20-2025 | 0.76 $* | 0.48 $* |
Apr-20-2025 | 0.40 $* | 0.55 $* |
Mar-20-2025 | 0.93 $* | 0.67 $* |
Feb-20-2025 | 0.28 $* | 0.43 $* |
Jan-20-2025 | 0.82 $* | 0.66 $* |
CPU | Freescale i.MX6D processor,ARM® Cortex™-A9 core |
Frequency | 1.0 GHz |
RAM | DDR3 SDRAM,4*256MB,total 1GB |
Flash | 4GB EMMC |
Communication | 3-ch RS232, 1 port as the debug UART, 2-ch RS232 multiplexes with RS485 ; 1-ch High speed USB OTG,4-ch USB HOST, 1-ch connects to MIN_PCIE Interface ; 2-ch CAN, support CAN2.0 protocol ; 1-ch 10/100/1000Mbps Ethernet port, with ACT/LINK indicator |
CSI&DSI interface | 2-ch LVDS port, HDMI, support HDMI 1.4 |
Audio | McASP audio interface; binaural output; MIC audio input |
Input | Standard I2C Capacitive panel |
Expansion Interface | MINI_PCIE 2.0 ;SIM Card ;EIM Bus |
Storage | 1*SD Card Interface;1-ch SATA Hard disk interface |
other onboard resource | Reset circuit, Watch dog, RTC, Buzzer, JTAG interface |
Power Input | +12V power supply, can support +4.75V~+18V wide range voltage supply |
Size | 160mm*125mm |
Layer | Core Board:8-layer high precision immersion gold process Back Board: 4-layer high precision immersion gold process |
Power Consumption | ≤3W |
Operation Temperature | -20℃ ~ +70℃ (Could be upgraded to industrial level temperature) |
Operation Humidity | 5% ~ 95%, Non-Condensing |
OS support | linux |
Данные ресурс не является интернет-магазином, а лишь содержит ссылки на международную торговую площадку Alibaba.com