Virtual Machine production line with BIOS Support silver wire bonding equipment copper making
- Категория: Electronic Products Machinery >>>
- Поставщик: Shenzhen,Shuangshi,Technology,Co.,Ltd.
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Описание и отзывы
Трекер стоимости
| Месяц | Минимальная цена | Макс. стоимость |
|---|---|---|
| Sep-20-2025 | 34034.88 $* | 35736.83 $* |
| Aug-20-2025 | 33748.6 $* | 35435.17 $* |
| Jul-20-2025 | 28314.83 $* | 29730.34 $* |
| Jun-20-2025 | 33176.71 $* | 34835.80 $* |
| May-20-2025 | 28886.34 $* | 30330.42 $* |
| Apr-20-2025 | 32604.11 $* | 34234.40 $* |
| Mar-20-2025 | 32318.76 $* | 33934.68 $* |
| Feb-20-2025 | 32032.68 $* | 33634.28 $* |
| Jan-20-2025 | 31746.8 $* | 33333.6 $* |
Характеристики
Virtual Machine Chipset production line with BIOS Support silver wire bonding eqiupment copper wire bonding making machine ISO Certification
1000#Glue Dispenser, Glue Dispensing Machine, Glue Dispensing Equipment, Online Thread Dispensing Machine ISO Certification
Equipment Introduction:
2000#Glue Dispenser, Glue Dispensing Machine, Glue Dispensing Equipment, Online Thread Dispensing Machine ISO Equipment Application and Industry:
Equipment Advantages:
After the product solidifies, it flows into the thermosetting machine and heats and solidifies the product.
After curing, the products will flow into the Wire Bonder Loader. The equipment will be allocated to idle Wire Bonder station according to the actual production situation of the production line to bond the gold wires on the products
The bonded products are sent to the spring clip or the next station through the unloader.
2000#Glue Dispenser, Glue Dispensing Machine, Glue Dispensing Equipment, Online Thread Dispensing Machine ISO Equipment Application and Industry:
In the CCM camera module process, the thermosetting products completed after Die bonder are distributed to several groups of Wire bonder stations through the precise magnetic wheel track transmission. On the premise of meeting the production requirements, the golden Wire bonder process is realized for the products.
Equipment Advantages:
1.High utilization rate, according to the actual production status of each equipment, real-time allocation of capacity, make full use of equipment capacity.
2.Cooperation between China and Japanese shinkawa company, mature and stable technology, excellent product binding effect and good stability.
3.Compatibility, compatible with single machine production, line production, with a cache unit, reduce before and after the station capacity interference.
4000#Glue Dispenser, Glue Dispensing Machine, Glue Dispensing Equipment, Online Thread Dispensing Machine ISO Certification
Equipment Parameters:
Equipment Parameters:
| General range of steel sheet | Min:70x150 mm Max:100x270 mm | |
| Model | Dwin-WB-Inline-A1 | |
| Time consuming for product specification change | New product | ≤30min |
| Debugged product | ≤15min | |
| Equipment cleanliness level | 100 | |
| Yield | ≥99% | |
| Height of operation table | 1150±50mm | |
| Dimensions | L1100 * W1100 * H1800mm( Without FFU height ) | |
| Air source specification | 0.5-0.7MPa(5kgf-7kgf/cm2) Usage:200L/min | |
| Power specifications | AC220V | |
| Total power | 4.5KW | |
5000#Glue Dispenser, Glue Dispensing Machine, Glue Dispensing Equipment, Online Thread Dispensing Machine ISO Certification
6000#Glue Dispenser, Glue Dispensing Machine, Glue Dispensing Equipment, Online Thread Dispensing Machine ISO Certification
7000#Glue Dispenser, Glue Dispensing Machine, Glue Dispensing Equipment, Online Thread Dispensing Machine ISO Certification
If you have any questions,please email me.i will reply to you ASAP
1000#Virtual Machine Chipset production line with BIOS Support silver wire bonding eqiupment copper wire bonding making machine
1200#Virtual Machine Chipset production line with BIOS Support silver wire bonding eqiupment copper wire bonding making machine
100#Virtual Machine Chipset production line with BIOS Support silver wire bonding eqiupment copper wire bonding making machine
000#Virtual Machine Chipset production line with BIOS Support silver wire bonding eqiupment copper wire bonding making machine
5000#Virtual Machine Chipset production line with BIOS Support silver wire bonding eqiupment copper wire bonding making machine
6000#Virtual Machine Chipset production line with BIOS Support silver wire bonding eqiupment copper wire bonding making machine
7000#Virtual Machine Chipset production line with BIOS Support silver wire bonding eqiupment copper wire bonding making machine
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