MANUFACTURING CAPABILITIES |
Standard |
CIRCUIT/PANEL SIZE |
Layer Count |
Up to 40 |
Double Side |
580*890mm |
Multilayer |
570*850mm |
MATERILA |
Standard |
Shengyi/FR-4 (S1141) |
High Tg |
Shengyi/ FR-4 (S1170, S1000-2) ITEQ/IT180 |
Halogen Free |
Shengyi/S1155/S1165 |
Special |
Rogers, Taconic, Arlon |
Plating Chemical Solutions |
ROHM and HAAS |
Others |
Available on request |
SURFACE FINISHES |
Standard |
Leaded HASL, Lead Free HASL, ENIG, OSP, Plating Nickel/Gold,Immersion Tin, Immersion Silver |
Selective Surface Treatment |
ENIG+OSP, ENIG+Gold Finger, Immersion Tin+Gold Finger, Immersion Silver+Gold Finger |
COPPER FOIL |
Base Copper thickness |
12um,18um,35um,70um,10um |
PTH |
Min. 25um |
Inner Layer |
5 oz/175um |
Outer Layer |
10 oz/350um |
Aspect Ratio |
14:01 |
Finished Borad thickness/Tolerance |
0.2-7.0mm ( ≤1.0mm±0.1; >1.0mm±10%) |
TRACE |
Min. Inner Layer trace width/Space |
0.10/0.10mm (Max.Cu 35um) |
Min. Outer Layer trace width/Space |
0.10/0.10mm (Max.Cu 35um) |
SOLDER MASK/SILK SCREEN |
Solder Mask |
Black, Matte, Green, Red, Yellow,White,Blue |
Via Filling Solder Mask/Eposy Resin |
0.8mm |
Peelable Solder Mask |
Yes |
Silk Screen |
White, Black, Yellow |
CNC DRILLING |
Min. Finished Hole Size (Mechanical) |
0.15mm |
Min. Finished Hole Size (Laser) |
0.05mm |
CRITICAL TOLERANCES |
Layer Registration |
±0.10mm |
Holes |
Hole Diameter (PTH) |
±0.050mm |
Hole Diameter (Non-PTH) |
±0.10mm |
Hole Position |
±0.05mm |
Slot hole (PTH) |
±0.15mm |
General |
Finished PCB Thickness |
0.10mm |
Routing Profile |
±0.15mm |
V-Cut Profile |
±0.15mm |
Warpage % |
0.70% |
Electrical Test % |
100% |
OTHER OPTIONS |
AOI |
All Multilayer |
Impedance Control |
±10% |
Solderability Testing |
Yes |
SPECIAL REQUIREMETNS |
Plated Slots |
Edge Plating |
Countersinking |
Edge Bevelling |
Others |
available on request |
